Average Reviews:
(More customer reviews)At first, I was looking for a book covering on-chip power integrity issue and happened to find this book on Amazon. Since I can not search inside this book, I just bought it and later found it is related to the power integrity of package, not chip. However, I DEFINITELY don't regret buying this book because it covers one of the important pieces in the design of power distribution network.
After reading chapter 1, I realize that the power integrity issue should be attacked from a system point of view, including chip, package and board. Only considering on-chip power integrity is not enough because the power supply is located on the board and electrically far away from the chip. The important concept of target impedance is also introduced and really opens my mind on how to design a robust power distribution network.
Chapter 2 covers the modeling of power/ground planes in high performance package and board. Two novel modeling methods, transmission matrix method and cavity-model method are desrcibed in detail here. The major advantages of the two methods over full wave methods, like FDTD and FEM, are ease of integrating into circuit simulators.
Chapter 3 covers the topic of simultaneous switching noises. The signal nets are modeled as uncoupled microstrip and strip transmission lines. The coupling effects between signals and power/ground planes are modeled as controlled sources, which are obtained by mode decomposistion methods. Then, the uncoupled transmission lines and controlled sources are integrated with the power/ground plane models from chapter 2 to conduct simultaneous switching noise analysis.
Chapter 4 introduces time-domain simulations of power distribution networks. The major foucs is how to incorporate s-parameter data into time-domain circuit simulators. The techniques like vetor fitting, passivitiy enforcement by Hamiltonian matrix , signal flow method, and MNA with s-parameter are explained and compared.
Chapter 5 applies the modeling and analysis methods from previous chapters to real applications. Great insight is learned from these real world problems.
I strongly recommend this book to the designers and CAD tool developers of power distribution networks. Since the major focus of this book is package power, I also recommend two other books which cover board and on-chip power integirty issue respectively:
"Frequency-Domain Characterization of Power Distribution Networks" by Istvan Novak and Jason R. Miller
"Power Distribution Networks with On-Chip Decoupling Capacitors" by Mikhail Popovich, Andrey V. Mezhiba, and Eby G. Friedman
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