2/02/2012

Computational Modeling in Semiconductor Processing (The Artech House Materials Science Library) Review

Computational Modeling in Semiconductor Processing (The Artech House Materials Science Library)
Average Reviews:

(More customer reviews)
This is a six chapter book, with six authors. As a result, the treatment of the subject matter is a bit uneven. Here is a snap shot of the chapters:
Chap 1 (Meyyappan) is a very general introduction
Chap 2 (Govindan & de Jong) reviews numerical methods. It is a good intro, but focuses on the finite difference method which isn't widely used (compared to the finite element and finite volume methods)
Chap 3 (Chan) focuses on crystal growth. It seems very comprehensive, but I am not an expert in this area
Chap 4 (Kleijn) is on chemical vapor deposition. This chapter is incredibly comprehensive and brilliantly written. Pretty much every aspect of CVD modeling is covered. This book is worth buying just for this chapter.
Chap 5 (Meyyappan) on plasma processes is a good introduction to the subject. Plasma modeling is incredibly complex and this chapter shows many simplifications used to make the problem tractable.
Chap 6 (Campbell). A very clear and readable description of modeling techniques used in Rapid Thermal Annealing.
The book provides enough information to understand the modeling methods used and where they are applied. It probably doesn't provide enough information to write your own programs.

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This text provides coverage of the models, governing equations and numerical techniques suitable for process simulation. It concentrates on such areas as chemical vapour deposition, metal-organic chemical vapour deposition, plasma processing, rapid thermal processing and crystal growth, as well as defining the basic principles of transport phenomena, gas phase and surface reactions in electronics materials processing. In addition, it explains how to apply practical numerical techniques used in process simulation, and presents the numerical methods necessary to produce simulation codes. The work is intended for those new to the field of process and equipment simulation in electronics materials processing, and also for the experienced modeller. It also contains coverage suitable for graduate students in materials science, and chemical, mechanical and electrical engineering.

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